Fiche technique / Composant COTS : THS4304
* Nano : Package Area < 30 [mm²] Micro : 30 [mm²] < Package Area < 60 [mm²] Standard : 60 [mm²] < Package Area < 105 [mm²]
3 V to 5 V Vcc
3 GHz ; 830 V/µs
2.8 nV/Hz
Fiche technique
Vcc from 2.7 V to 12 V ; Rail-to-Rail In/Out
2.7Mhz ; +1 V/µs ; 0.75 mA / Amp IC
Fiche technique
Up to 26 V vcc
Rail-to-rail out
Up to 1pA Ib
Up 0.75 mV Vos
2 V/µS ; 2.5 MHz
Fiche technique
Dual ; 0.4mV Vos
4V to 40V Vcc
Rail-to-Rail In to V-
1.7Mhz ; 0.5 V/μs
Fiche technique
-4 V to +110 V V cm
Up to 20 V Vcc
Up to 2,25 mA Iq
Fiche technique
Vcc from 3 V to 30 V ; Rail-to-Rail In/Out
0.3 V/µs ; GBP =0.6 MHz; Ib ± 10nA
Fiche technique
Quad ; 325 μV Vos
2.7 V to 12 V Vcc
Rail-to-Rail Out
15Mhz ; 13 V/μs
9.5 nV/√Hz
Fiche technique
Dual ; 325 μV Vos
2.7 V to 12 V Vcc
Rail-to-Rail Out
15Mhz ; 13 V/μs
9.5 nV/√Hz
Fiche technique
Vcc from 5 V to 10 V
Rail-to-rail out
145 MHz ; 180 V/µs
7 nV/√Hzn ; 0.6 fA/√Hz
Fiche technique
-16 V to +80 V V cm
Up to 18 V Vcc
Jusqu’à 1 mA Icc
3 V to 5 V Vcc
3 GHz ; 830 V/µs
2.8 nV/Hz
